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Brand Name : KAZ Circuit
Model Number : PCBA-S-096444
Certification : ISO9001, TS16949, UL, RoHS
Place of Origin : China
MOQ : 1 pc
Price : USD/pc
Payment Terms : T/T,Western Union,Paypal
Supply Ability : 20,000 Square Meters / Month
Delivery Time : 2~3 weeks
Packaging Details : Bubble Wrap
Layers : 2 layers
Board Thickness : 1.6mm
Copper : 1oz
Surface : HASL LF
Soldmask : Green
Silk Screen : White
prototype development high-mix low-volume production SMT PCB Assembly
 
Detail Specifications:
| Layers | 2 | 
| Material | FR-4 | 
| Board Thickness | 1.6mm | 
| Copper Thickness | 1oz | 
| Surface Treatment | HASL LF | 
| Soldmask & Silkscreen | Green & White | 
| Quality Standard | IPC Class 2, 100% E-testing | 
| Certificates | TS16949, ISO9001, UL, RoHS | 
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the information as below:
Manufacturer Capacity:
 
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month  |  
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) | 
| Board Thickness | 0.3~4.0mm | 
| Layers | 1~20 layers | 
| Material | FR-4, Aluminum, PI | 
| Copper Thickness | 0.5~4oz | 
| Material Tg | Tg140~Tg170 | 
| Max PCB Size | 600*1200mm | 
| Min Hole Size | 0.2mm (+/- 0.025) | 
| Surface Treatment | HASL, ENIG, OSP | 
SMT Capacity

Prototype development high-mix low-volume production SMT PCB Assembly
Definition:
Prototype development high-mix low-volume production SMT PCB assembly refers to the process of assembling printed circuit boards (PCBs) for prototype development and low-volume production runs using surface mount technology (SMT). SMT is a method of assembling electronic components directly onto the surface of a PCB, rather than inserting them into holes in the board.
Applications:
Prototype development high-mix low-volume production SMT PCB assembly is ideal for:
Creating prototypes of new electronic products
Producing small batches of custom PCBs
Manufacturing low-volume production runs of PCBs
Advantages:
Reduced size and weight: SMT components are smaller and lighter than traditional through-hole components, resulting in smaller and lighter PCBs.
Higher density: SMT allows for a higher density of components on a PCB, enabling more functionality in a smaller space.
Improved performance: SMT components have shorter leads, which reduces inductance and capacitance, leading to improved signal integrity and performance.
Lower cost: SMT assembly is more automated than traditional through-hole assembly, resulting in lower labor costs.
Increased reliability: SMT components are less likely to experience solder joint failures due to the shorter leads and more precise soldering process.
Process:
The prototype development high-mix low-volume production SMT PCB assembly process typically involves the following steps:
Design: The PCB is designed using computer-aided design (CAD) software.
Fabrication: The PCB is fabricated using a process called photolithography.
Solder paste application: Solder paste is applied to the PCB at the locations where the components will be placed.
Component placement: SMT components are placed on the PCB using a pick-and-place machine.
Reflow soldering: The PCB is passed through a reflow oven, which heats the solder paste and reflows it, forming solder joints between the components and the PCB.
Inspection: The PCB
Photoes of this prototype development high-mix low-volume production SMT PCB Assembly




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                        Green Soldmask SMT PCB Assembly Prototype Development High-mix Low-volume Production Images |